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Items |
General |
Advance |
Remarks |
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Material |
CEM-3 FR4 (Tg140) FR4 (Tg180) Al base etc.. |
Isola Rogers Nelco Cu base |
Material need be purchased specially for advance |
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Max layers |
18 |
30 |
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Max PCB size |
24”x 21” |
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PCB thickness |
20-160mil |
Min: 12mil Max: 300mil |
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PCB thickness tol |
≥40mil: ±10% <40mil:±4mil |
≥40mil: ±7% <40mil:±3mil |
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Min core thickness |
4mil |
2mil |
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Min trace/space (inner layers) |
Hoz: 4/4mil 1oz: 5/5mil 2oz: 6/7mil 3oz: 8/8mil |
Hoz: 3/3mil 1oz: 4/4mil 2oz: 5/5.5mil 3oz: 6/7mil |
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Min trace/space (outer layers) |
1/3oz: 4/4mil Hoz: 4/5mil 1oz: 5/5.5mil 2oz: 7/8mil 3oz: 10/10mil |
1/3oz: 3/3mil Hoz: 3.5/4.5mil 1oz: 4/5mil 2oz: 6/6mil 3oz: 8/8mil |
Base copper foil;
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Max copper thk. |
5oz |
8oz |
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Min drill size |
Mechical: 8mil Laser: 5mil |
Mechical: 6mil Laser: 3mil |
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Hole diameter tol |
±3mil |
±2mil |
or with equal range |
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Slot size tol |
L±5mil * W±4mil |
L±4mil * W±3mil |
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Aspect Ratio |
8:1 |
12:1 |
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PTH wall Cu thk |
0.7-1.0mil min |
1.5mil min |
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S/M type |
Green, Bule, Black, Yellow, Red, Purple, White |
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Min S/M web |
4mil |
2.8mil |
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Silkscreen Type |
White, Yellow, Black |
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Surface finishing |
HASL HASL LF ENIG (2u” Au) Immersion Ag Immersion Tin OSP |
HASL HASL LF ENIG (4u” Au) Immersion Ag Immersion Tin OSP Ni/Pd/Au |
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Hard gold |
Au 10u”(min) |
Au 40u”(min) |
edge fingers plating |
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V-cut Angle |
30°, 45° |
60°, 90° |
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Outline dimension tolerance |
±6mil |
±4mil |
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Impedance control |
±10% |
±7% |
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Vias (BVH) |
Yes |
Yes |
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Micro Vias (HDI) |
1+N+1 |
2+N+2 |
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Bow & Twist |
0.7% max |
0.4% max |
per board structure |
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Others |
/ |
Back drills Heatsink projects Buried capacitance Buried resistance Metal base project (multi-layer) |
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